Package and its manufacturing method

Patent Type: Invention Patent Inventor: Tadada; Kumura Katsuhiko; Umeda Tengsan; Yukio Kenzai Applicant: Matsushita Electric Industrial Co., Ltd. Master Applicant Address: Osaka, Japan Application No. 1
Application Date: 2005.03.25
Approval notice number: 1805883
Auditing Announcement Date: 2006.07.19
Main classification number: B65D75/36 (2006.01)I
Classification No.: B65D75/36(2006.01)I; B65D65/40(2006.01)I; B65D65/46(2006.01)I
Category classification number:
Priority item: 2004.3.29 JP 096348/2004
Manual CD-ROM: D0629-1
International application: 2005-03-25 PCT/JP2005/005543
International Publication: 2005-10-06 WO2005/092737 Summary: In order to obtain a package with a simple structure, a simple manufacturing method, a lower product cost, a lower manufacturing cost, a higher packaging strength and a better appearance A package is formed by the following steps: a first printing layer, an anti-offset layer, and an observation from the first surface side that can be viewed from the second surface side of the base are formed only on the first surface of the translucent substrate The second printing layer, and the second surface side of the base, provide a receiving device for accommodating articles.
Sovereignty items: 1. A package comprising: a lining comprising a light transmissive base; and a first printing layer, an anti-printing layer, and a first layer sequentially laminated on a first surface of the base; And a storage device for holding the liner on the second surface side of the base.
Agency: Yongxin Patent & Trademark Agency Co., Ltd. Agent: Yu Hui Database Name: Invention Patent Database

Reprinted from: Wanfang Data

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