New Technology
Printable conductive metal materials often have to trade off the rheological and conductive properties of the material. The binder and carrier used to provide flow during printing and adhesion to the substrate affects the conductivity of the final composite layer and prevents current flow through the wire.
However, there is a process which provides a way to make addition preparation and substrate adhesion independent of the printed portion's conduction requirements. The conductive ink technology (CIT) has developed a process in which a catalytic ink is printed on a substrate and the ultraviolet rays are cured to provide a rapidly processed adhesive substrate. The base layer itself is not conductive, but it acts as a catalyst for the electroless deposition of the metal layer.
The printed cured substrate is immersed in a commercially available electroless plating bath and the thick metal layer at the top of the base bath is deposited. This two-stage process allows the plating baths to be optimized for different substrate materials and different printing tools, respectively, without affecting the conductivity of the final process. The process can use most of the standard electroless plating metals, including nickel, cobalt, and palladium, but copper is the most commonly used and most widely used. The two stages of the process can be performed inline, or electroless plating can be performed as a batch process afterwards.
Copper typically grows in the range of 20 nanometers per minute to 90 nanometers per minute (equivalent to bulk copper), which produces a sheet resistance of 30 ohms during about 10 minutes of plating. Usually the resistivity is 2.5 times larger than the bulk metal (copper), but it depends on the bath and the conditions used.
The optimal conduction range for CIT processes is greater than 10 ohms (equivalent to 1.5 to 2 microns of bulk copper). It is suitable for a wide range of applications, including UHF RFID (radio frequency identification), keypad membranes, low-current PCB (signal), low-power heater assemblies, a wide range of sensor applications, and many other flexible and rigid applications. For higher conductivity and greater current carrying capacity, post-process plating can also be performed.
Inkjet resolution
The CIT process is designed for piezoelectrically controllable print heads such as those manufactured by Xaar, Konica Minolta and Spectra. The typical native resolution of these printheads is from about 180 to 360 nozzles per inch, and is designed to print at a resolution higher than 360 dots per inch, with drops below about 40 pl. Such print resolution can generally provide a size equivalent to 100 micron line width on a polyester or polyimide substrate. However, a new generation of grey printheads supports variable drops of up to about 32 pl, which results in digital print sizes of about 50 microns or less.
Digital Manufacturing System
A wide range of systems can be used for digital production of flexible circuits. Located in the lower part of the range is a small development system such as Dimatix's DMP series. Such printers will produce A4 paper at different resolutions by using disposable 16-nozzle print heads. Due to the small number of nozzles on the print head, the yield of such systems is low, but it can be perfectly used for development and precise research.
Systems such as the X4000 series from Xennia Technologies or the XY100 from Konica Minolta will be more suitable for production. These systems are also based on the A4 format, which uses larger industrial print heads such as the Xaar Omnidot series or the Konica Minolta KM512 series. These systems have a print bandwidth of up to 70 mm and a productivity of up to 1 to 2 square meters per minute. Similar systems can also provide a width of 1 meter or more, depending on the printhead and the desired configuration.
CIT has also teamed up with Preco to develop the narrow-web digital printing tool, the lJet 6000, for in-line tape-and-reel production of flexible circuits and radio frequency identification (RFID) antennas. The system prints and cures on a 140 mm platform and executes our patented electroplating module, which significantly reduces the footprint and complexity required for in-line electroless plating of network materials. Current print head technology allows the system to produce flexible circuits at a rate of 0.56 (equals to 4.7 square meters per minute) per millisecond, which typically produces products such as UHF RFID antennas at a rate of 0.3 per millisecond (equal to 2.5 square meters per minute). . The system is modular and can be configured to increase production speed and/or deposition thickness.
These solutions, in most cases, submit the CAD drawing so that the usual turnaround time for a 10-m2 single-layer board does not exceed 1 hour.
to sum up
The new digital technology provides additive and no-processing methods for the production of small and medium-sized PCBs using the NRE's minimum rapid process. The ability to separate jetting characteristics and ink adhesion from the electrical properties of the material provides independent control of the conductivity of the wire. The use of inkjet printing as a production method provides high throughput and a short turnaround time without adding to the front-end processing costs.
Printable conductive metal
January 24 11:06:12, 2020
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