Japan developed high thermal conductivity epoxy resin

Hitachi, Ltd. has recently developed a product with 5 times higher thermal conductivity than ordinary epoxy resin. It is said that this is the epoxy resin with the highest thermal conductivity.
It is reported that this new product does not use inorganic fillers or physical treatments such as alignment and stretching, but uses a molecular design method to achieve a thermal conductivity of 0.96 watts/m2k. And successfully controlled the molecular design unit at the nanometer level. The molecular design constructed by mesogen makes it the most thermally conductive resin in the world.

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